IFIP Working Conference on Distributed and Parallel Embedded Systems
September 7th - 10th, 2008
hosted as part of the IFIP World Computer Congress
Embedded systems build the key technological components of all kinds of complex technical systems, ranging from telecommunications devices to automobiles, aircraft and even complete production lines. Traditionally, such embedded control systems have been implemented in a monolithic, centralized manner, but distributed solutions have steadily been gaining popularity. In a distributed setup, the control task is carried out by a number of controllers distributed over the entire system and interconnected as a network by communication components such as field buses. The individual nodes of such a network usually consist of a processor (microcontroller) together with some sensors and actuators. More demanding local control applications require more powerful controllers based on parallel architectures such as multiprocessor systems-on-chips (MPSoCs) or VLIW. Distribution and parallelism in embedded system design increase the engineering challenges and demand new development methods!
and tools. Also, the increasing relevance of intelligent applications like autonomous systems or systems with self-x properties calls for new design methods and tools. Due to the growing complexity of these kinds of embedded systems, their development requires new, consistent and integrated design methodologies, covering the path from specification to implementation.
DIPES will be an ideal opportunity to present exchange and discuss the state of the art, novel ideas, actual research results, and future trends in the field of distributed embedded systems. Contributors and participants from both industry and academia are encouraged to take active part in this conference.
Authors are invited to submit manuscripts of original unpublished research work in all areas. Relevant topics include (but are not limited
1. Specification and modelling of complex embedded systems
2. Design methodology for distributed and parallel embedded systems
3. Design support for intelligent features in embedded systems
4. Validation and verification of embedded systems
5. Novel programming techniques for distributed real-time systems
6. Operating systems and middleware for distributed real-time systems
7. Self-x properties in distributed embedded systems
8. Partitioning and allocation of tasks
9. Distributed real-time operating systems
10. Real-time communication systems
11. Software synthesis for real-time applications
12. Mixed continuous/discrete systems
13. HW/SW co-design for distributed embedded systems
14. Specific (parallel) architectures for distributed embedded systems
15. Dependability and fault tolerance of distributed embedded systems
16. Low power design of embedded systems
17. Case studies of distributed embedded systems
December 1st, 2007: Submissions due
February 20th, 2008: Notification of acceptance
March 20th, 2008: Final papers due
You may submit full papers up to 10 pages or extended abstracts (3 - 5 pages) describing original work on the topics above or related ones via the DIPES conference URL http://www.c-lab.de/dipes. Extended abstracts should provide a summary of the main results and some details to allow the program committee to assess their merits and significance, including references and comparisons. The contribution must be unpublished and not submitted for publication elsewhere, including journals and the proceedings of other symposia or workshops. One author of each accepted paper has to present it at the conference. The proceedings will be published by Springer Science and Business Media, the official IFIP publisher. The final paper may be up to 10 pages in 11 point or larger with a text area of 7" x 4.75". Further formatting guidelines can be found at the publisher's website http://springer.com/series/6102 or at the DIPES website.
General Chair: Wayne Wolf, University of Princeton, USA
PC Chair: Bernd Kleinjohann, University of Paderborn/C-LAB, Germany
Publication Chair: Lisa Kleinjohann, University of Paderborn/C-LAB, Germany